Software architects designing critical embedded systems have tough choices to make when selecting an operating system. Decisions can be both simplified and complicated with new framework and platform initiatives coming into being.
Operating systems that control critical embedded systems have many stringent requirements that they must be able to address in order for them to be considered for deployment. There will always be debate about the best operating systems to deploy in critical applications. However, improvements in real-time operating capabilities in Windows and Linux have opened up the door to options in addition to traditional Real-Time Operating Systems(RTOSs).
The speed of innovation in automotive IVI is making a lot of heads turn. No question, Linux OS and Android are the engines for change.
The open source software movement has forever transformed the mobiledevicelandscape. Consumers are able to do things today that 10 years ago were unimaginable. Just when smartphone and tablet users are comfortable using their devices in their daily lives, another industry is about to be transformed. The technology enabled by open source in this industry might be even more impressive than what we’ve just experienced in the smartphone industry.
The industry isautomotive, and already open source software has made significant inroads in how both driver and passenger interact within theautomobile. Open source stalwartsLinuxand Google are making significant contributions not only in the user/driver experience, but also insafety-criticaloperations,vehicle-to-vehicle communications, and automobile-to-cloudinteractions.
IT managers are under increasing pressure to boost network capacity and performance to cope with the data deluge. Networking systems are under a similar form of stress with their performance degrading as new capabilities are added in software. The solution to both needs is next-generation System-on-Chip (SoC) communications processors that combine multiple cores with multiple hardware acceleration engines.
The data deluge, with its massive growth in both mobile and enterprise network traffic, is driving substantial changes in the architectures of base stations, routers, gateways, and other networking systems. To maintainhigh performanceas traffic volume and velocity continue to grow, next-generation communications processors combinemulticoreprocessors with specialized hardware acceleration engines inSoCICs.
The following discussion examines the role of the SoC in today’s network infrastructures, as well as how the SoC will evolve in coming years. Before doing so, it is instructive to consider some of the trends driving this need.
Virtualization for embedded systems has many implementations in which two or more operating systems coexist to gain the benefits of each. One approach puts Microsoft Windows and a Real-Time Operating System (RTOS) together.
Much is being said about virtualization these days in the softwareworld. Simply stated, virtualization is about getting multiple OSs to run on the same computing platform at the same time. Virtualization has been cited as a key technology for getting the most performance out of the newest multicore processors. But just as not all computing applications are the same, not all virtualization approaches are appropriate for all applications.
Embedded systems have a key requirement that doesn’t normally apply to office and server computers: the need for deterministic response to real-time events. To support the requirement for determinism, embedded applications typically use RTOSs. Embedded applications also employ general-purpose OSs to handle operator interfaces, databases, and general-purpose computing tasks.
In the past, because OSs couldn’t successfully co-reside on computing platforms, system developers employed multiple processing platforms using one or more to support real-time functions and others to handle general-purpose processing. System designers that can combine both types of processing on the same platform can save costs by eliminating redundant computing hardware. The advent of multicore processors supports this premise because it is possible to dedicate processor cores to different computing environments; however, the software issues posed by consolidating such environments require special consideration. Combining real-time and general-purpose operating environments on the same platform (Figure 1) places some stringent requirements on how virtualization is implemented.
With advances in wireless technologies, defining a strategy for building wireless M2M-enabled devices is not the dauntingly complex task it was once thought to be. Instead of devoting precious R&D resources to the integration of fragmented, ad hoc technologies, today’s developers can take advantage of increasingly sophisticated Embedded Application Frameworks (Linux, Android, and others), some of which are highly optimized for M2M application development.
Embedded world, the biggest and most important event of its kind, opens the series of high-tech exhibitions , now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services.
“The embedded world Exhibition&Conference is growing continuously and rapidly in the same way that the embedded sector is gaining in importance – the embedded community can look forward to a record event,” says Alexander Mattausch, Exhibition Manager of embedded world. The specialists can also look forward once again to figures such as Prof. Nicholas McGuire or Dr. David Kalinsky, who have given the embedded world Conference a face, weight, spirit and know-how at a high professional standard for years.
The AMB-QM77T1 is the newest Mini-ITX industrial mainboard from Acrosser Technology that supports both of the 3rd and 2nd generation Intel Core i7/i5/i3 mobile processor by Intel QM77 chipset and FCPGA 988 socket.
The key features of the AMB-QM77T1 include: ‧ Intel QM77 chipset ‧ FCPGA socket supports 3rd Generation Intel® Core(TM) i7/i5/i3 processors and Celeron ‧ 2* DDR3-1600/1333/1066 SO-DIMM up to 16GB ‧ Supports VGA/DVI-D/HDMI/LVDS displays ‧ Support 3 independent display ‧ Dual Intel PCI-E Gigabit LAN ‧ 8* USB 2.0, 4* USB 3.0, 3* COM, 3* SATA II, 2* SATA III ‧ 1* PCI-E x16, 1* Mini PCI-E, 1* CFast socket ‧ iAMT 8.0, TPM 1.2, Watchdog timer, Digital I/O Support VGA and DVI output
The ACM-B6360 carries on board Intel 3rd gnenration Core i7-3615QE FCBGA1023 processor which supports three independent display with multiple output : 24-bit LVDS, VGA, HDMI and one DDI interface. One PCI-E x16 Gen., 3.0 and seven PCI-Ex1 interfaces for IO expansion. It is suitable for Medical, Test & Measurement and Transportation applications.
1. COM Express Basic Type 6 Module with Fan heatsink
2. Onboard Intel 3rd Generation Core i7-3615QE BGA processor.
3. Two DDR3 SO-DIMM sockets with ECC supportted, up to 16G
4. Supports 3 independent display output
5. 1 x PCI-E x16 Gen.3, 7x PCI-E x1 interfaces
6. 2 x SATAIII ports, 2 x SATAII ports
7. 4 x USB 3.0 ports, 4 x USB 2.0 ports
8. 1 x GbE, I2C, SMBus, LPC interface
AMB-D255T1, which carries the Intel dual- core 1.86GHz Atom Processor D2550. AMB-D255T1 features powerful graphic performance via VGA and HDMI, DDR3 SO-DIMM support, mSATA socket with USB signals and SIM slot, and a DC jack for easy power in. AMB-D255T1 also provides complete I/O such as 4 x COM ports, 6 x USB2.0 ports, 1 x GbE RJ-45 port, 1 x SATA port with power connector.
AMB-D255T1 can support dual displays via VGA, HDMI or LVDS. AMB-D255T1 has one MiniPCIe type expansion slot with SIM card socket for customer’s expansion. This expansion slot works with SATA and USB signals that can be equipped with mSATA storage module, Wi-Fi module, or 3G/4G telecommunication module.
VIA Eden processors are scalable from 400MHz to 1.5GHz all within a maximum thermal envelope of 7.5 watts, and are available with a diverse range of feature sets that enable PC functionality and connectivity from traditionally single function devices.
The VIA Eden processor family is available in nanoBGA, nanoBGA2 and EBGA packaging, using 150nm, 130nm and the latest 90nm SOI manufacturing process to deliver leading performance per watt and in fully RoHS compliant packages.