How are these technical problems best solved, by industry and the EEMBC?
refer to: http://embedded-computing.com/articles/moving-qa-markus-levy-founder-president-eembc/
The 4th generation Intel® Core™ processors
The 4th generation Intel® Core™ processors serve the embedded computing space with a new microarchitecture which Kontron will implement on a broad range of embedded computing platforms. Based on the 22 nm Intel® 3D processor technology already used in the predecessor generation, the processors, formerly codenamed ‘Haswell’, have experienced a performance increase which will doubtlessly benefit applications. Beside a 15% increased CPU performance especially the graphics has improved by its doubled performance in comparison to solutions based on the previous generation processors. At the same time, the thermal footprint has remained practically the same or has even shrunk.
These improvements and the high scalability from cost-optimized Celeron® versions up to high-end Intel® Core™ i7 and Xeon® processors make the new Intel® Core™ microarchitecture a perfect match for nearly each and every mid-range to high-end embedded applications. In a first step Kontron has implemented the new microarchitecture on COM Express®, Mini-ITX, 6U CompactPCI®, and the Kontron SYMKLOUD Media cloud platforms with further platforms to follow. So, in what way can embedded appliances benefit from these improvements?
refer to: http://embedded-computing.com/white-papers/white-intelr-coretm-processors/
DDR3L memory modules resolve the embedded computer double refresh rate requirement by selecting the lowest total electrical current, incorporating thermal-relief copper pour methodology PCB design, reducing chip count, and utilizing 1.35 V DDR3 Dynamic Random-Access Memory (DRAM). Compared to current DDR3 designs, DDR3L memory can save up to +10 °C per module and remove the double refresh rate requirement. DDR3L VLP memory embedded computer module helps improve airflow and provides a low profile, allowing OEMs to offer higher-reliability products that reduce total cost of ownership. Specific DDR3L VLP modules also offer single refresh rates, which are now essential to maximize performance in high-temperature systems.
refer to : http://embedded-computing.com/articles/ruggedization-memory-module-design/
(DM&P) Fanless ISA Bus SBC with DM&P Vortex86DX 800MHz, VGA, LAN, FDD, IDE, CF, 2 x COM, 4 x USB2.0
AR-B8170 based on DM&P Votrex86DX chipsets, on board 800MHz processor, on board 256MB DDRII-333MHz memory and 64MB video memory. it design for factory automation.
ITS/Telematics Excellent 100 – Fanless and Dustproof Intel 945GME Core 2 Duo Vehicle Computer
AR-V5403FL adopt Core 2 Duo CPU in vehicle computers as the hardware platform to install in their 40 thousands service trucks. This project integrated the RF ID reader, OBD2 terminal, sensors and hand held terminals to improve the operation efficiency of the huge fleet.
Fanless and Dustproof Intel 945GME Embedded System
1. Intel 945GME + ICH7M
2. Support Core 2 Duo/Core Duo/Celeron M
4. Dual Giga LAN
5. PCI-104 Expansion
6. Anti-Shock 2.5″ HDD Mounting Kit
7. Audio, USB2.0, IDE, CFII, COM, GPIO, SATA
Fanless ISA Bus SBC with DM&P Vortex86DX 800MHz, VGA, LAN,FDD, IDE, CF, 2 x COM, 4 x USB2.0
ISA half-size CPU board with DM&P Vortex86DX 800MHz SoC and 256MB DDRII memory. The key component on AR-B8172 like CPU and memory is onboard design to avoid the shock and vibration issue that is happened in the machine used in factory.
Fanless ISA Bus SBC with DM&P Vortex86DX 800MHz,VGA,FDD,IDE,2 x COM,4 x USB2.0
AR-B8170 based on DM&P Votrex86DX chipsets, on board 800MHz processor, on board 256MB DDRII-333MHz memory and 64MB video memory. it design for factory automation
1. Fanless Design
2. Onboard DM&P Vortex86DX 800MHz
3. Onboard 256MB DDR2 SDRAM
4. 2 x COM, 4 x USB2.0, VGA
Embedded SBC_Mini-ITX_Intel Core 2 Duo and Celeron M_Intel GME965 + Intel ICH8M_AR-B5690
1. Intel Core 2 Duo, Celeron M
2. Intel GME965 + ICH8M
3. Memory Supports DDR2 up to 4GB
4. VGA / DVI / LVDS
5. 4 x COM, 10 x USB2.0, SATA, CF