Stay social with the Acrosser AMB-D255T3 Mini-ITX Board!

To further promote acrosser products, we will continue to enrich our web content and translate our website into more languages for our global audience. This month, Acrosserhas created a short film that highlights its Mini-ITX board, AMB-D255T3, using close-ups to capture its best features from different angles.

One fascinating feature of the AMB-D255T3 is its large-sized heatsink, rendering better thermal conductivity in the board. Secondly, the large amount of intersecting aluminum fins increases heat radiation area as well as heat-dissipation efficiency. The fanless design also eliminates the risk of fan malfunction, raising its product life expectancy. Without a fan, the single board computer AMB-D255T3 can perform steadily in a cool and quiet way.

Using the Intel ATOM D2550 as a base, the AMB-D255T3 was developed to provide abundant peripheral interfaces to meet the needs of different customers. For those looking for expansions, the board provides one Mini PCIe socket for a wireless or storage module. Also, for video interfaces, it features dual displays via VGA, HDMI or 18-bit LVDS, satisfying as many industries as possible.

In conclusion, Acrosser’s AMB-D255T3 is a perfect combination of low power consumption and great computing performance. The complete set of I/O functions allows system integrators to apply our AMB-D255T3 to all sorts of solutions, making their embedded ideas a reality.

Product Information:
http://www.acrosser.com/Products/Single-Board-Computer/Mini-ITX-&-others/AMB-D255T3%E3%80%80(Mini-ITX-)/Intel-Atom-D2550-AMB-D255T3-(Mini-ITX)-.html

Follow us on Twitter!
http://twitter.com/ACROSSERmarcom

Contact us:
http://www.acrosser.com/inquiry.html

Acrosser Introduces the Book-Sized Fanless Mini PC Video

To illustrate the high performance of AES-HM76Z1FL, Acrosser created a short film, explicating the multiple features of our ultra thin embedded system. From its exterior look, this book-sized mini PC embodies great computing performance within its small form factor.

The arrangement of the I/O slot has taken product design and industrial applicability into consideration perfectly. Despite AES-HM76Z1FL’s small form factor, a wide selection of I/O ports including HDMI, USB, LAN, COMBO, GPIO and COM can be found on both sides of the product. Moreover, our model can be integrated horizontally or vertically, making it a flexible option that caters to many different industries. We are sure that these concepts make AES-HM76Z1FL a more feasible choice than other embedded systems.

 

The second part of the video demonstrates the 4 major applications of our AES-HM76Z1FL mentioned in our previous announcement: digital signage, kiosk, industrial automation and home automation. Aside from these four applications, Acrosser believes there are still many other applications for which the AES-HM76Z1FL would be useful.

Through the video, Acrosser was able to demonstrate the best features of the AES-HM76Z1FL, and allow our customers to easily see its power and versatility.

Finally, we would like to offer our gratitude to the vast number of applicants for the Free Product Testing Event. This program is easy to apply to, and still going on right now! Having reached the halfway mark for the event, many system integrators and industrial consultants have already provided plenty of interesting ideas for us. For those who have not applied the event, Acrosser welcomes you to submit your amazing proposals!

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Contact us:
http://www.acrosser.com/inquiry.html

Enhanced Cybersecurity Services: Protecting Critical Infrastructure

Comprehensive cybersecurity is an unfortunate necessity in the connected age, as malwares like Duqu, Flame, and Stuxnet have proven to be effective embedded pc instruments of espionage and physical sabotage rather than vehicles of petty cybercrime. In an effort to mitigate the impact of such threats on United States Critical Infrastructure (CI), the Department of Homeland Security (DHS) developed the Enhanced Cybersecurity Services (ECS) program, a voluntary embedded system framework designed to augment the existing cyber defenses of CI entities. The following provides an overview of the ECS program architecture, technology, and entry qualifications as described in an “on background” interview with DHS embedded pc officials.

At some point in 2007, an operator at the Natanz uranium enrichment facility in Iran inserted a USB memory device infected with the Stuxnet malware into an Industrial Control System (ICS) running a Windows Operating System. Over the next three years, the embedded system would propagate over the Natanz facility’s internal network by exploiting zero-day vulnerabilities in a variety of Windows OSs, eventually gaining access to the Programmable Logic Controllers on a number of Industrial Control Systems (PCSs) for the facility’s gas centrifuges. Stuxnet then injected malicious code to make the centrifuges spin at their maximum degradation point of 1410 Hz. One thousand of the 9,000 centrifuges at the Natanz facility were damaged beyond repair.

In February 2013, Executive Order (EO) 13,636 and Presidential Policy Directive (PPD)-21 ordered the DHS to develop a public-private partnership model to protect United States CI entities from cyber threats like Stuxnet. The result was an expansion of the Enhanced Cybersecurity Services (ECS) program from the Defense Industrial Base (DIB) to 16 critical industrial pc.

Enhanced Cybersecurity Services framework

At its core, the embedded system pc is a voluntary information-sharing framework that facilitates the dissemination of government-furnished cyber threat information to CI entities in both the public and private sectors. Through the program, sensitive and classified embedded system information is collected by agencies across the United States Government (USG) or EINSTEIN sensors1 placed on Federal Civilian Executive Branch (FCEB) agency networks, and then analyzed by DHS to develop “threat indicators”. DHS-developed threat indicators are then provided to Commercial Service Providers (CSPs)2 that, after being vetted and entering a Memorandum of Agreement (MOA) with DHS, may commercially offer approved ECS services to entities that have been validated as part of United States CI. The ECS services can then be used to supplement existing cyber defenses operated by or available to CI entities and CSPs to prevent unauthorized access, exploitation, and data exfiltration.

In addition, CSPs may also provide limited, anonymized, and industrial cybersecurity metrics to the DHS Office of Cybersecurity & Communications (CS&C) with the permission of the participating CI entity. Called Optional Statistical Information Sharing, this practice aids in understanding the effectiveness of the ECS program and its threat indicators, and promotes coordinated protection, prevention, and responses to malicious cyber threats across federal and commercial domains.

Enhanced Cybersecurity Services countermeasures the initial implementation of ECS, including two countermeasures for combating cyber threats: Domain Name Service (DNS) sinkholing and embedded pc e-mail filtering.

DNS sinkholing technology is particularly effective against malwares like Stuxnet that are equipped with distributed command and control network capabilities, which allows threats to open a connection back to a command and control server so that its creators can remotely access it, give it commands, and update it. The DNS sinkholing capability enables CSPs to prevent communication with known or suspected malicious Internet domains by redirecting the network connection away from those domains. Instead, CSPs direct network traffic to “safe servers” or “sinkhole servers,” both hindering the spread of the malware and preventing its communications with embedded pc cyber attackers.

The e-mail filtering capability is effective in combating cyber threats like Duqu, for example, which spread to targets through contaminated Microsoft Word e-mail attachments (also known as phishing), then used a command and control network to exfiltrate data encrypted in image files back to its creators. The e-mail filtering capability enables CSPs to scan attachments, URLs, and other potential malware hidden in e-mail destined for an entity’s networks and potentially quarantine it before delivery to end users.

Accreditation and costs for Enhanced Cybersecurity Services

The CS&C is the DHS executive agent for the ECS program, and executes the CSP security accreditation process and MOAs, as well as validation of CI entities. Any CI entity from one of the 16 key infrastructure sectors can be evaluated for protection under the ECS program, including state, local, tribal, and territorial governments.

For CSPs to complete the security accreditation process, they must sign an MOA with the USG that defines ECS expectations and specific program activities. The MOA works to clarify the CSP’s ability to deliver ECS services commercially while adhering to the program’s security requirements, which include the ability to:

Accept, handle, and safeguard all unclassified and classified indicators from DHS in a Sensitive Compartment Information Facility (SCIF) Retain employee(s) capable of holding classified security clearances for the purposes of handling classified information (clearance sponsorship is provided by DHS)
Implement ECS services in accordance with security guidelines outlined in the network design provided on signing of the embedded pc versions of MOA.

Privacy, confidentiality, and Enhanced Cybersecurity Services

“ECS does not involve government monitoring of private communications or the sharing of communications content with the government by the CSPs,” a DHS official told Industrial embedded systems.  Although CSPs may voluntarily share limited aggregated and anonymized statistical information with the government under the ECS program, ECS related information is not directly shared between customers of the CSPs and the government.

“CS&C may share information received under the ECS program with other USG entities with cybersecurity responsibilities, so long as the practice of sharing information is consistent with its existing policies and procedures. DHS does not control what actions are taken to secure private networks or diminish the voluntary nature of this effort. Nor does DHS monitor actions between the CSPs and the CI entities to which they provide services. CI entities remain in full control of their data and the decisions about how to best secure it.”

refer to:http://industrial-embedded.com/articles/enhanced-protecting-critical-infrastructure/

Fanless Mini-ITX mainboard with Intel Atom Processor “Cedar Trial” D2550

acrosser Technology Co. Ltd, a global professional industrial and Embedded Computerprovider, announces the newMini-ITX mainboard, AMB-D255T3, which carries the Intel dual- core 1.86GHz Atom Processor D2550. AMB-D255T3 features onboard graphics via VGA and HDMI, DDR3 SO-DIMM support, PCI slot, mSATA socket with SATA & USB signals, and ATX connector for easy power in. AMB-D255T3 also provides complete I/O such as 6 x COM ports, 6 x USB2.0 ports, 2 x GbE RJ-45 ports, and 2 x SATA port.
AMB-D255T3 can support dual displays via VGA, HDMI or 18-bit LVDS. AMB-D255T3 has one MiniPCIe type slot and one PCI for customer’s expansion. The MiniPCIe slot works with SATA and USB signals that can be equipped with mSATA storage module.
AMB-D255T3 is certainly an excellent solution for applications that require powerful computing while still maintaining low-power consumption in a small form factor motherboard and has a complete set of I/O functions. Users can deploy the system solution with this fan-less mainboard easily. Ideally, it is a fast time-to-market weapon for system integrators.

Key features:
‧ Intel Atom D2550 1.86GHz
‧ 1 x DDR3 SO-DIMM up to 4GB
‧ 1 x VGA
‧ 1 x HDMI
‧ 1 x 18-bit LVDS
‧ 6 x USB2.0
‧ 6 x COM
‧ 2 x GbE (Realtek RTL8111E)
‧ 1 x PS/2
‧ 1 x KB/MS
‧ 1 x MiniPCIe slot
‧ 1 x PCI slot
‧ 2 x SATA ll
‧ 8-bit GPIO

Product Information:
http://www.acrosser.com/Products/Single-Board-Computer/Mini-ITX-&-others/AMB-D255T3 (Mini-ITX-)/Intel-Atom-D2550-AMB-D255T3-(Mini-ITX)-.html

Contact us:
http://www.acrosser.com/inquiry.html

Automotive Embedded Systems of Android in vehicles

Challenges with Android in the car

In 2012, for the first time in its 26-year history, the J.D. Power Auto Quality Study found that the embedded system is now the biggest source of problems in new cars. Therefore, OEMs are justifiably concerned with the reliability, stability, and security of Android.

Android’s extremely large source code base coupled with its open source development model results in extreme churn – literally thousands of edits per day across Android and its underlying Linux kernel. This guarantees a steady flow of vulnerabilities. A quick search of the U.S. CERT National Vulnerability Database turns up numerous vulnerabilities of varying severity for in-vehicle infotainment systems. Here is a sampling of the worst offenders:

We point these particular vulnerabilities out because they fall into the highest severity category of remote exploitability. They are used by hackers to root Android phones and tablets, and automotive manufacturers want to ensure that the same vulnerabilities do not threaten Android- or Linux-based infotainment systems.

Another concern with Android is driver/passenger safety. Automotive electronics architecture is in the midst of a major trend reversal: Instead of adding more and more processors for new functions, disparate functions are being consolidated into a smaller number of high-performance multicore processors in order to reduce size, weight, power, and component/wiring cost. Processor consolidation is leading safety-critical systems to be integrated with infotainment. The consolidation trend is aided by next-generation, performance-efficient multicore processor platforms, such as the “Jacinto” and OMAPprocessor families including TI’s OMAP 5 platform, which offers a dual-core, power-efficient ARM Cortex-A15 processing architecture.

Additionally, such mixed-criticality system consolidation, for example, includes OEMs looking to host real-time clusters, rear-view cameras, and Advanced Driver Assistance Systems (ADAS) within the center stack computer. Next-generation Android infotainment systems must ensure that applications and multimedia seamlessly interact with safety functions, and pose no risks to passengers.

 

refer to:http://embedded-computing.com/articles/the-future-android-vehicles/

The Reliable Software Developers’ Conference – UK, May 2014

Technology event organiser Energi Technical has announced that it will be launching “The Reliable Software Developers’ Conference”, scheduled for May 2014.

This one-day conference will provide an important forum for engineers and developers working in the development of safety critical systems and high availability systems. It is expected to attract software developers working in such industries as automotive, railway systems, aerospace, bankingmedical and energy. www.rsd-conference.co.uk

“In recent years, software has become so complex that ensuring safety and reliability is now a major challenge,” said Richard Blackburn, Event Organiser. “Many systems now have millions of lines of code and will handle enormous amounts of data. Further to this, modern computer based systems will make millions of decisions every second and also have to be immune to interference and unpredictable events. This event will look at the MISRA coding standards, debug tools and software testing tools that are available to assist software programmers and engineers seeking to develop reliable and safety critical
systems.”

The Reliable Software Developers’ Conference will be co-located with the 2014 UK Device Developers’ Conference. Both will be a one-day conference to be run in Bristol, Cambridge, Northern England and Scotland on May 20th, May 20rd, June 3rd and June 5th.

Delegates attending either event will have the opportunity to sit in on technical presentations and ½ day technical workshops and a attend a vendor exhibition of tools and technology for the development of real-time and embedded systems. www.device-developer-conference.co.uk

“Advanced Debug Tools, Code Test, Version Control, Verification Tools and Software Standards have been a growing feature of recent conferences, so it made sense to create a dedicated event,” said Richard. “There will be a lot expertise available to delegates, and the chance to meet a broad range of vendors of test technologies and tools, all under one roof.”

Developed in collaboration with MISRA (Coding Standards), the Reliable Software Developers’ Conference will feature a number of presentations in the morning, followed by a half-day technical workshop in the afternoon. The presentations will be free and open to delegates of both Conferences, but the half-day workshops will be subject to a charge of £75. Delegates will learn about developments in coding standards, test and verification tools and best practices and it will also be an opportunity to meet with many industry experts.

Refer to:http://embedded-computing.com/news/the-uk-may-2014/

Acrosser wish you Happy Holidays and a very prospective 2014 coming soon!

As we near the end of 2013, acrosser would like to send you our warmest New Year’s wishes! We wish you and your family health, comfort, and prosperity this holiday season.

We also thank you for keeping up with our latest products, sending us inquiries, and choosing our products for your integrated solution! In 2014, we hope you will continue to choose Acrosser. We look forward to assisting you and your company in becoming the leader in your vertical market, and building a win-win relationship together.

And don’t forget about our star product, AES-HM76Z1FL, and its upcoming Product Testing Event in January! Remember to mark your calendar, since Acrosser is lending the product for free only to selected participants! Please stay tuned for more event information in early January!

With your continuous dedication and our commitment to quality, Acrosser is always motivated to make your embedded idea a reality!

 

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Contact us:
http://www.acrosser.com/inquiry.html

Comprehensive customization for network appliances: meet our rackmount and micro box!

 

acrosser Technology, a world-leading network communication designer and manufacturer, introduces two network appliances that deliver great performance and protection while simplifying your network. Each product has its own target market and appeals to a unique audience.

Acrosser’s ANR-IB75N1/A/B serves as an integrated Unified Threat Management (UTM) device that covers all of your networking security needs. Featuring a 3rd generation Intel Core i processor, increased processing throughput is easily made. For integration with information security systems, the device also features functions such as anti-virus, anti-spam, fire wall, intrusion detection, VPN and web filtering, in order to provide complete solutions to meet the demands of various applications.

Key features of the ANR-IB75N1/A/B include:
‧Support for LGA1155 Intel® Core ™ i7/i5/i3 processor / Pentium CPU
‧Intel B75 Chipset
‧2 x DDRIII DIMM, up to 16GB memory.
‧2 x Intel 82576EB Fiber ports
‧8 x Intel 82574L 10/100/1000Mbps ports
‧Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
‧LAN bypass can be controlled by BIOS and Jumper
‧CF socket, 2 x 2.5” HDD, 1 x SATA III, 1 x SATA II
‧Console, VGA (pinhead), 2 x USB 3.0 (2 x external)
‧Support boot from LAN, console redirection
‧Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
‧LCM module to provide user-friendly interface
‧Standard 1U rackmount size

As for our micro box, the AND-D525N2 provides more possibilities for different applications due to its small form factor (234mm*165mm*44mm). Aside from its space-saving design, the other 3 major features of the AND-D525N2 are its high performance, low power consumption and competitive price. Please send us your inquiry via our website (http://www.acrosser.com/inquiry.html), or simply contact your nearest local sales location for further information.

Key features of the AND-D525N2 include:
‧Intel Atom D525 1.86GHz
‧Intel ICH8M Chipset
‧x DDR3 SO-DIMM up to 4GB
‧1 x 2.5 inch HDD Bay, 1 x CF socket
‧4 x GbE LAN, Realtek 8111E
‧2 x USB2.0
‧2 x SATA II
‧1 x Console
‧1 x MiniPCIe socket

Besides In addition to these two models, Acrosser also provides a wide selection of network security hardware. With more than 26 years of rich industry experience, Acrosser has the ODM/OEM ability to carry out customized solutions, shortening customers’ time-to-market and creating numerous profits.

For all networking appliances product, please visit:
http://www.acrosser.com/Products/Networking-Appliance.html

Product Information – ANR-IB75N1/A/B:
http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1/A/B/Networking-Appliance-ANR-IB75N1/A/B.html

Product Information – AND-D525N2:
http://www.acrosser.com/Products/Networking-Appliance/MicroBox/AND-D525N2/ATOM-D525-AND-D525N2.html

Contact us:
http://www.acrosser.com/inquiry.html

INDUSTRIAL ETHERNET GROWING IN CHINA

December 5, 2013 – The Chinese market for industrial Ethernet & Fieldbus Technologies grew by 18 million nodes in 2012. More than 3 million nodes used Ethernet and the remainder used Fieldbus technology.

Although Fieldbus has a large base of new connected nodes in China, the usage of Fieldbus is not as common as in developed countries such as Germany or the United States. This is mainly because Chinese customers are encountering networking technology much later than those developing countries.

However, the growing speed of Ethernet is quite considerable in China and we think it is a great opportunity for Chinese customers to upgrade their automation system under current market condition. Customers will just jump from old Fieldbus Technologies direct to Ethernet now and actually many of them are doing right now. The Chinese market is currently engaged in extensive upgrading and new infrastructure construction, and that will require a great deal of Ethernet applications.

refer to:http://www.automation.com/portals/industrial-networks-field-buses/industrial-ethernet-growing-in-china

High Computing Performance for All Applications- F.I.T. Technology

The demand for computing performance in the IPC market continues to become stronger as the IT field advances. Acrosser’s new AES-HM76Z1FL has been designed to meet these demands.
The F.I.T. Technology used to build this new product reflects its 3 major features: fanless design, Intel core i processor and ultra thin frame. The fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. With a height of less than 0.8 inches, AES-HM76Z1FL’s slim design makes itself FIT into every application.
As its structure and output interface show, AES-HM76Z1FL provides a wide range of choices, from HDMI, VGA, USB, and audio to GPIO output interfaces that suit almost all industries. For wireless communication needs, the AES-HM76Z1FL has a mini-PCle expansion slot which provides support on both 3.5G and WiFi.
Another fascinating feature of the AES-HM76Z1FL is its ease of installation for expansions. By disassembling the bottom cover, expansions such as CF cards, memory upgrades and mini-PCIe can be easily complete without moving the heat sink. Moreover, Acrosser adopts 4 types of CPU (Intel Core i7/i3, Intel Celeron 1047UE/927UE) for AES-HM76Z1FL, allowing it to satisfy the scalable market demands of different applications.
In conclusion, the AES-HM76Z1FL is truly a well-rounded product designed for diverse applications. To promote our star product AES-HM76Z1FL, Acrosser will launch a product testing campaign starting in January, 2014. Acrosser will provide selected applications with the new AES-HM76Z1FL for one month, and it’s free! For more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at www.acrosser.com!Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html