Embedded world, the biggest and most important event of its kind, opens the series of high-tech exhibitions , now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services.
“The embedded world Exhibition&Conference is growing continuously and rapidly in the same way that the embedded sector is gaining in importance – the embedded community can look forward to a record event,” says Alexander Mattausch, Exhibition Manager of embedded world. The specialists can also look forward once again to figures such as Prof. Nicholas McGuire or Dr. David Kalinsky, who have given the embedded world Conference a face, weight, spirit and know-how at a high professional standard for years.
The AMB-QM77T1 is the newest Mini-ITX industrial mainboard from Acrosser Technology that supports both of the 3rd and 2nd generation Intel Core i7/i5/i3 mobile processor by Intel QM77 chipset and FCPGA 988 socket.
The key features of the AMB-QM77T1 include: ‧ Intel QM77 chipset ‧ FCPGA socket supports 3rd Generation Intel® Core(TM) i7/i5/i3 processors and Celeron ‧ 2* DDR3-1600/1333/1066 SO-DIMM up to 16GB ‧ Supports VGA/DVI-D/HDMI/LVDS displays ‧ Support 3 independent display ‧ Dual Intel PCI-E Gigabit LAN ‧ 8* USB 2.0, 4* USB 3.0, 3* COM, 3* SATA II, 2* SATA III ‧ 1* PCI-E x16, 1* Mini PCI-E, 1* CFast socket ‧ iAMT 8.0, TPM 1.2, Watchdog timer, Digital I/O Support VGA and DVI output
The ACM-B6360 carries on board Intel 3rd gnenration Core i7-3615QE FCBGA1023 processor which supports three independent display with multiple output : 24-bit LVDS, VGA, HDMI and one DDI interface. One PCI-E x16 Gen., 3.0 and seven PCI-Ex1 interfaces for IO expansion. It is suitable for Medical, Test & Measurement and Transportation applications.
1. COM Express Basic Type 6 Module with Fan heatsink
2. Onboard Intel 3rd Generation Core i7-3615QE BGA processor.
3. Two DDR3 SO-DIMM sockets with ECC supportted, up to 16G
4. Supports 3 independent display output
5. 1 x PCI-E x16 Gen.3, 7x PCI-E x1 interfaces
6. 2 x SATAIII ports, 2 x SATAII ports
7. 4 x USB 3.0 ports, 4 x USB 2.0 ports
8. 1 x GbE, I2C, SMBus, LPC interface